High-efficiency Panasonic NPM-TT2 chip mounter machine
The Panasonic NPM-TT2 chip mounter is a high-performance modular chip mounter from Panasonic Electronics Manufacturing, designed for high-precision, high-efficiency SMT production. The following are its key features and specifications:
Core Performance
Placement Speed and Accuracy
8-Nozzle Head: Placement speed reaches 36,000 cph (0.1 sec/chip) for PC size, 34,920 cph for M size; placement accuracy: ±40μm (chips), ±30μm (QFP 12-32mm), ±50μm (QFP <12mm).
3-Nozzle Head: Supports odd-shaped components, handling up to 150×25×30mm, with a placement speed of 14,400 cph (PC size). Substrate
Processing Capacity
PC Size: Single track, maximum 510 x 590 mm, dual track, 510 x 300 mm; M size: single track, maximum 510 x 510 mm, dual track, maximum 510 x 260 mm.
Substrate Replacement Time: Single track, 4 seconds (when no components on the back side), dual track, 0 seconds (cycle time > 4 seconds).
Features
Flexible Configuration: Supports switching between 8 nozzle heads (for general-purpose components) and 3 nozzle heads (for special-shaped components), and can be reconfigured with the tray feeder/exchange trolley to accommodate various component feed formats.
Intelligent Identification: Multifunctional cameras enable high-speed height detection, improving placement stability for special-shaped components.
Scalability: Directly connects to NPM-D3/W2 systems, supporting options such as automatic support pin replacement and a transfer unit for optimized model switching efficiency. Technical Parameters
Power Supply: Three-phase AC 200-480V, 2.5kVA; Air pressure source must be ≥0.5MPa, 200L/min.
Dimensions and Weight: 1300 × 2798 × 1444mm (W × D × H); Main Unit Weight: 2690kg
High-efficiency Panasonic NPM-TT2 chip mounter machine
The Panasonic NPM-TT2 chip mounter is a high-performance modular chip mounter from Panasonic Electronics Manufacturing, designed for high-precision, high-efficiency SMT production. The following are its key features and specifications:
Core Performance
Placement Speed and Accuracy
8-Nozzle Head: Placement speed reaches 36,000 cph (0.1 sec/chip) for PC size, 34,920 cph for M size; placement accuracy: ±40μm (chips), ±30μm (QFP 12-32mm), ±50μm (QFP <12mm).
3-Nozzle Head: Supports odd-shaped components, handling up to 150×25×30mm, with a placement speed of 14,400 cph (PC size). Substrate
Processing Capacity
PC Size: Single track, maximum 510 x 590 mm, dual track, 510 x 300 mm; M size: single track, maximum 510 x 510 mm, dual track, maximum 510 x 260 mm.
Substrate Replacement Time: Single track, 4 seconds (when no components on the back side), dual track, 0 seconds (cycle time > 4 seconds).
Features
Flexible Configuration: Supports switching between 8 nozzle heads (for general-purpose components) and 3 nozzle heads (for special-shaped components), and can be reconfigured with the tray feeder/exchange trolley to accommodate various component feed formats.
Intelligent Identification: Multifunctional cameras enable high-speed height detection, improving placement stability for special-shaped components.
Scalability: Directly connects to NPM-D3/W2 systems, supporting options such as automatic support pin replacement and a transfer unit for optimized model switching efficiency. Technical Parameters
Power Supply: Three-phase AC 200-480V, 2.5kVA; Air pressure source must be ≥0.5MPa, 200L/min.
Dimensions and Weight: 1300 × 2798 × 1444mm (W × D × H); Main Unit Weight: 2690kg
